TSMC announces its new R&D strategy

Yesterday, TSMC held a press conference in Japan hosted by Jack Sun, current VP of Research and Development in which the company's new R&D policies for 2009 were announced to the industry at large.

As of now, the chipmaker primarily focuses itself in advanced CMOS technologies. It has announced that it will begin a shift to more specialized packing technologies in addition to CMOS such as analog, RF, power, image sensors and MEMS circuits.

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