Xbox 360 consoles have been notoriously unreliable. But some of the more hopeful observers think that the newest models might be more consistent.
They carry a new motherboard, dubbed Jasper, with a new and improved graphics chip. In the past, the easily-overheated graphics chip often snapped loose from its mounting, leading to unrecoverable console failure, otherwise known as the Red Ring of Death. Microsoft was unable to address this problem until it created the new generation chip, which is manufactured in a 65-nanometer chip-making process instead of a 90-nanometer process.
The new chip will be smaller and cost less to make. But more importantly, it will emit less heat, allowing it to fit snugly into its motherboard socket. And that, in turn, should lead to fewer system repairs.