Industry to start move to 450mm wafers in 2012

Tim Smalley reports:

''Intel, Samsung Electronics and TSMC have reached an agreement to push forwards with plans to move semiconductor manufacturing to 450mm wafers starting in 2012.

The trio say that they'll cooperate with the rest of the semiconductor industry to ensure that all of the required components, infrastructure and capability are developed in readiness for a 450mm pilot line in 2012.''

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